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CONSORTIUM MEMBERS

 


 

 

Organization / Principle Investigator

Country

RTD role

Project leader:

 

 

 

1

 National Center of Scientific Research - Demokritos

   Dr. A. Dimoulas

Greece

  • Development of passivation methodologies and gate dielectrics on Ge & III-V small area (two inch) substrates

  • Characterization (in-situ XPS and Kelvin probe, XRD and electrical evaluation by MIS)

  • Gate metals/workfunction engineering

Contractors:

2

Interuniversity Microelectronics Center

Dr. M. Caymax

Belgium

  • Dual-channel engineered substrates / selective epitaxy

  • Front-end processing of III-V semiconductors in 65 nm/ 200 mm pilot line

  • Dual channel Ge/III-V transistors on engineered substrates

3

IBM Research GmbH / Zurich Research Laboratory

Dr. C. Marchiori

Switzerland

 

  • Gate dielectric development with an emphasis on large area (8 inch) III-V substrates.

  • Development of growth of III-V active channels on epi-GaAs/GeOI substrates

  • Surface cleaning and passivation of III-V semiconductors

4

Commissariat l' Energie Atomique -LETI

Dr. C. Reita

France

  • Development of local GeOI/SOI by Ge condensation on 8 inch substrates

  • Electrical evaluation of the substrates using Ψ-MOSFETs

  • TEM characterization of threading dislocations

  • Raman characterization of strain

5

ST Microelectronics-Crolles

Dr. D. Bensahel

France

  • On-wafer testing of short channel Ge pMOS and III-V nMOS transistors on 200 mm substrates, with an emphasis on channel mobility.

  • Performance estimation using MASTAR software

  •  Benchmarking with “best Si” tech.

7

AIXTRON

Prof. M. Heuken

Germany

  • Development and manufacturing of 200/300 mm III-V selective epitaxy MOCVD tool.

8

UoG
University of Glasgow

Prof. A. Asenov

U.K.

  • Monte Carlo modeling of III-V MOSFETs with an emphasis to implant-free devices

  • Simulation of Ge based transistors using TCAD tools

  • Development of Au-free S/D contacts for III-V nMOSFETs

9

KULeuven
Katholike Universitaet Leuven

Prof. J.-P. Locquet

Belgium

  • TEM characterization of III-V channels and gate stacks

  • Characterization of gate stacks and interfaces by synchrotron radiation